AMD Ryzen 9 4900HS Review - Renoir APU Meets The Expectations
It is fair to say that Ryzen 9 4900HS is a breakthrough for laptop CPUs with integrated graphics. This model, in particular, amazed the users with its graphics chipset.
First, let's quickly share the technical details. The Ryzen 9 4900HS processor is basically an 8/16 chip with 4 MB L2 and 8 MB L3 cache. It can accelerate the speed up to 3.8 GHz with all its cores, it also has 8 Vega CUs operating at 1750 MHz under 35 watts TDP. The support for the RAM is up to 3200 MHz for DDR4. And it climbs to 4266 MHz with LPDDR4 type memory.
In the Cinebench R15 multi-core tests shared by different users, it’s seen that a score of 1894 is achieved by Ryzen 9 4900HS. Therefore, it performs noticeably better than the Core i9-9880H which achieved 1155 in the same tests. Besides, even when the Core i9-9880H doubles its TDP from 45 watts to 90 watts, the point reaches 1648, still falls behind the Ryzen 9 4900HS.
On the other hand, AMD Ryzen 9 4900HS with integrated 8-core Vega 8 GPU delivers nearly double the gaming performance of integrated graphics in 10th Gen Intel Core mobile chips. In various benchmarks tests, Vega 8 turned out to be even more productive than the NVIDIA GeForce MX250 video card. AMD's solution produced a higher frame rate in GTA V, Civilization VI, CS: GO, and Gears 5. Interestingly, in Civilization Vega 8 achieved to be almost on the same level as NVIDIA GeForce GTX 1650 Max-Q. With such innovation in integrated graphics, AMD immediately attracted laptop gamers.
Ryzen 9 4900HS also gets approval from many users with its single-core performance. Much everyday work depends on single-core power such as office programs and browsers. Likewise, professional applications like CADs, don’t really need multi-threaded performance.
AMD Ryzen™ 9 4900HS Specifications
- Cpu Cores : 8
- Threads : 16
- Clock Speed : 8 3.0GHz
- L1 Cache : Up to 4.3GHz
- L2 Cache : 4MB
- L3 Cache : 8MB
- Unlocked : No
- CMOS : TSMC 7nm FinFET
- Package : FP6
- PCI Express Version : PCIe® 3.0
- Thermal Solution (PIB) : 35W
- TDP : 105°C
- Max Temp. : DDR4 - Up to 3200MHz
- System Memory Spec. : 16
- System Memory Type : 8
- System Memory Channel : 3.0GHz
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